MANILA, Philippines – AMD showed off its third generation of Ryzen processors on Monday, May 27, at Computex 2019 in Taiwan.

A new Zen 2 microarchitecture brings better performance for the 5 Ryzen processors announced: the Ryzen 5 3600 and 3600X, the Ryzen 7 3700X and 3800X, and the Ryzen 9 3900X.

The 5 processors will be PCIe 4.0 enabled and will still use an AM4 socket, allowing some AMD 300- and 400-series motherboards to use the chips.

Among the processors, the Ryzen 9 3900X – a 12-core, 4.6GHz (if on Boost) powerhouse – is the flagship product.

The full lineup as seen below, however, does have something for everyone’s need or prospective budget.

The company also announced a new AMD X570 chipset for socket AM4. which it touted as “the world’s first PCIe 4.0 supported chipset with more than 50 new motherboards at launch.”

Teasing RDNA-powered graphics

AMD also teased its new gaming architecture, called RDNA, which it said would power a new line of Radeon RX 5700-series graphics processing units (GPUs).

The company said RDNA is “expected to deliver incredible performance, power, and memory efficiency in a smaller package compared to the previous generation Graphics Core Next (GCN) architecture.”

This, according to AMD, means better gaming performance at lower power and with reduced latency.

AMD’s Radeon RX 5700-series graphics cards are slated to arrive in July, with more to be announced during a presentation at E3, on June 10 at 3 pm Pacific. – Rappler.com